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HDI high density interconnect boards, one of the fastest growing technologies in PCBs, are now available at Eolane SCM. HDI interconnect board contains blind and/or buried vias and often contains microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

There are 6 different types of HDI high density interconnect boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias, passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.